Effects of O2 Plasma Treatments on the Photolithographic Patterning of PEDOT:PSS

Abstract

Poly (3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) is known for its potential to replace indium–tin oxide in various devices. Herein, when fabricating finger-type PEDOT:PSS electrodes using conventional photolithography, the cross-sectional profiles of the patterns are U-shaped instead of rectangular. The films initially suffer from non-uniformity and fragility as well as defects owing to undesirable patterns. Adding a small amount of hydrolyzed silane crosslinker to PEDOT:PSS suspensions increases the mechanical durability of PEDOT:PSS patterns while lifting off the photoresist. To further improve their microfabrication, we observe the effects of two additional oxygen (O2) plasma treatments on conventional photolithography processes for patterning PEDOT:PSS, expecting to observe how O2 plasma increases the uniformity of the patterns and changes the thickness and U-shaped cross-sectional profiles of the patterns. Appropriately exposing the patterned photoresist to O2 plasma before spin-coating PEDOT:PSS improves the wettability of its surface, including its sidewalls, and a similar treatment before lifting off the photoresist helps partially remove the spin-coated PEDOT:PSS that impedes the lift-off process. These two additional processes enable fabricating more uniform, defect-free PEDOT:PSS patterns. Both increasing the wettability of the photoresist patters before spin-coating PEDOT:PSS and reducing its conformal coverage are key to improving the photolithographic microfabrication of PEDOT:PSS.