Author:
Wei Xingchun,Wang Xiaowen,Qu Dingfeng,Zhu Zongxiao,Chen Weihua,Chen Wenbang,Shi Tianzuo,Peng Bin
Abstract
In this study, the nanogrinding process for single-crystal nickel was investigated using a molecular dynamics simulation. A series of simulations were conducted with different tool radii and grinding methods to explore the effects of chip morphology, friction forces, subsurface damage, and defect evolution on the nanogrinding process. The results demonstrate that the workpiece atoms at the back of the tool were affected by the forward stretching and upward elastic recovery when no chips were produced. Although the machining depth was the smallest, the normal force was the largest, and dislocation entanglement was formed. The small number of defect atoms indicates that the extent of subsurface damage was minimal. Moreover, when spherical chips were produced, a typical columnar defect was generated. The displacement vector of the chip atoms aligned with the machining direction and as the chips were removed by extrusion, the crystal structure of the chip atoms disintegrated, resulting in severe subsurface damage. By contrast, when strip chips were produced, the displacement vector of the chip atoms deviated from the substrate, dislocation blocks were formed at the initial stage of machining, and the rebound-to-depth ratio of the machined surface was the smallest.
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces
Cited by
1 articles.
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