Influence of Tuning Potential Parameters on Wettability of Smooth Copper Plate: A Molecular Dynamic Study

Abstract

The influences of interactions between copper plate and nano-water droplets on wettability with different solid–liquid potential parameters were studied, and the spread of droplets was compared and analyzed using the molecular dynamics method. The diameter of droplet spreading and the amount of water molecules adsorbed on the copper gradually increased with the potential parameters, whereas the absolute potential energy value between copper and water also increased. Negative potential energy represents the attraction force between solid atoms and liquid molecules, and the attraction grows stronger with the large absolute value of negative potential energy. The heat transfer performance of the wettability surface can be explained by analyzing the force of solid and liquid from the perspective of energy. These results are of great significance for establishing the wettability model of a smooth plate correctly and the design and manufacture of a special functional surface.