Design and Research of Laminated Packaging Structure for Semiconductor Laser Diode

Abstract

The primary factor influencing semiconductor laser performance is photoelectric conversion efficiency. In this study, a heat sink structure in the form of a laminated DC-mount package was created using Solidworks 2018 in accordance with the semiconductor laser C-mount packaging structure specifications. The Workbench 17.0 program theoretically derived the link between the device’s junction temperature and power, and then optimized the size of its heat sink. The primary characteristics of semiconductor laser devices with various C-type and DC-type heat sink architectures were then packaged and compared. Results demonstrate that thermal resistance decreased by 31%, the power of the semiconductor laser device with a DC packaging structure increased by 0.5 W, and photoelectric conversion efficiency increased to over 60%, thereby lowering the temperature at the device junction and thermal resistance. at least to a certain point. the effect of the parasitic parameters of the package is effectively improved. Finally, the 3000 h life test confirmed this package construction’s stability.