The Investigations of Novel Circuits Printing on Substrates by Aerosol Jet Printing-Reference-Cited by-同舟云学术

The Investigations of Novel Circuits Printing on Substrates by Aerosol Jet Printing

Published:2024-05-01 Issue:5 Volume:14 Page:557
ISSN:2079-6412
Container-title:Coatings
language:en
Short-container-title:Coatings

Author:

Yao Qingyu¹^ORCID,Gu Feng²³^ORCID,Cao Lei²,Wang Zengsheng¹

Affiliation:

1. Faculty of Engineering, Huanghe Science & Technology University, Zhengzhou 450003, China

2. Nanchang Key Laboratory for Advanced Manufacturing of Electronic Information Materials and Devices, International Institute for Innovation, Jiangxi University of Science and Technology, Nanchang 330013, China

3. Alber Particle Science and Technology Research Institute, Nanchang 330013, China

Abstract

Aerosol jet printing (AJP) is a straightforward write–fabrication technique with high resolution, design flexibility, and integration capabilities [...]

Funder

Henan Provincial Key Discipline Project—Machinery

Henan Provincial Private University Discipline Funding Project—Mechanical Design, Manufacturing, and Automation

Publisher

MDPI AG

Link

https://www.mdpi.com/2079-6412/14/5/557/pdf

Reference18 articles.

1. Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications;Gupta;IEEE Trans. Compon. Packag. Manuf. Technol.,2019

2. A review of aerosol jet printing—A non-traditional hybrid process for micro-manufacturing;Wilkinson;Int. J. Adv. Manuf. Technol.,2019

3. A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing;Craton;IEEE Trans. Microw. Theory Tech.,2020

4. Yeo, W.-H., and Kim, Y.-S. (2024). Smart and Connected Wearable Electronics, Woodhead Publishing.

5. Application of Aerosol Jet 3-D Printing With Conductive and Nonconductive Inks for Manufacturing mm-Wave Circuits;Piekarz;IEEE Trans. Compon. Packag. Manuf. Technol.,2019