Parylene-AlOx Stacks for Improved 3D Encapsulation Solutions-Reference-Cited by-同舟云学术

Parylene-AlOx Stacks for Improved 3D Encapsulation Solutions

Published:2023-11-14 Issue:11 Volume:13 Page:1942
ISSN:2079-6412
Container-title:Coatings
language:en
Short-container-title:Coatings

Author:

Buchwalder Sébastien¹²^ORCID,Bourgeois Florian³,Leon Juan J. Diaz⁴^ORCID,Hogg Andreas³^ORCID,Burger Jürgen¹^ORCID

Affiliation:

1. School of Biomedical and Precision Engineering, University of Bern, 3010 Bern, Switzerland

2. Graduate School for Cellular and Biomedical Sciences, University of Bern, Mittelstrasse 43, 3012 Bern, Switzerland

3. Coat-X SA, Eplatures-Grise 17, 2300 La Chaux-de-Fonds, Switzerland

4. CSEM Sustainable Energy Center, Jaquet-Droz 1, 2002 Neuchâtel, Switzerland

Abstract

The demand for ultra-tight encapsulation solutions with excellent barrier and high conformality properties has increased in recent years. To meet these challenges, thin-film barrier coatings have emerged as a promising solution. In this study, we investigate well-established silicon-based plasma-enhanced chemical vapor deposition (PECVD) and metal oxide atomic layer deposition (ALD) barrier coatings deposited at low temperatures (≤100 °C) regarding their abilities to address high-level 3D encapsulation applications. Various combinations of such layers are evaluated by measuring the water vapor transmission rate (WVTR) and considering the conformality properties. The impact and the benefits of the organic film integration, namely parylene VT4 grade, on the barrier performances is assessed. Among these combinations, parylene-AlOx stack emerges as one of the most effective solutions, obtaining a WVTR of 3.1 × 10−4 g m−2 day−1 at 38 °C and 90% relative humidity conditions.

Funder

Innosuisse, the Swiss Innovation Agency

Publisher

MDPI AG

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces

Link

https://www.mdpi.com/2079-6412/13/11/1942/pdf

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