Modelling Particle Motion during High-Voltage Electrostatic Abrasive Implantation Based on Multi-Physics Field Coupling

Author:

Zheng Huifeng,Wang Wenjie,Gong Liang,Chen Ge

Abstract

Electrostatic abrasive implantation technology is a classical process based on electrostatic field to implant abrasive particles into base material. However, there is still not a quantitative model to ensure the implantation performance due to the fact that the electrostatic abrasive implantation is a complex multi-physics coupled process. To ensure the quality of sandpaper and elucidate the complex motion mechanism of Al2O3 based abrasive particles in a high voltage electrostatic field, a multi-physical field coupling simulation model is proposed. First, the mechanical model is constructed for the complex problem of the electrostatic abrasive implantation process. Then, the field model is established for the problem that the superposition of multi-physical fields leads to complicated environmental conditions. Finally, the evaluation model is established for the problems that the abrasive planting effect is difficult to evaluate and the planting parameters are difficult to adjust. Besides, a tailored electrostatic abrasive planting testing equipment is designed for the implantation performance analysis purpose. Single-parameter electrostatic abrasive planting experiments were conducted to analyze and verify the effect of different pole plate voltage and pole plate spacing on the abrasive implantation rate. To ensure the implantation performance, the applicable pole plate spacing ranges from 30 mm to 50 mm and the suitable voltage is 20–40 kV according to the simulation result in the proposed two models. Meanwhile, the implantation rate experimentation shows the coupling field model coincides with the experiments better. The key factors affecting the electrostatic abrasive planting process are identified, and a feasible multi-physical field coupled abrasive particle motion simulation model is proposed.

Funder

Shanghai Municipal Science and Technology Major Project

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Optimization,Mechanical Engineering,Computer Science (miscellaneous),Control and Systems Engineering

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3