Theoretical and Simulation Analysis on Fabrication of Micro-Textured Surface under Intermittent Cutting Condition by One-Dimensional Ultrasonic Vibration-Assisted Turning

Abstract

Fabricating micro-textures with specific parameters (size, shape, and distribution) on the surface of mechanical components has the potential to improve the tribological performance. When the ultrasonic vibration is applied to depth direction of turning, the micro-textured surfaces with specific dimples can be generated in a simple and effective way. Under the intermittent cutting condition, the generation mechanism of the micro-textured surface, processed by this one-dimensional ultrasonic vibration-assisted turning (1D UVAT), was further carried out. A novel theoretical model was firstly proposed from the perspective of geometric kinematics, which can reveal the influence of three intersection states between the flank face and cutting trace (η1 < tan α, η1 > tan α > η2 and η2 > tan α) on the size, shape, and distribution of micro-dimples, generated under intermittent cutting conditions. Then, a simulation model was built to predict the surface topography and dimple profile under different processing parameters. The results show that the processing parameters, including clearance angle, spindle speed, and vibration amplitude, have an important influence on the intersection state. By choosing the proper clearance angle, spindle speed, or vibration amplitude, the different intersection states can be realized, and the corresponding size, shape, and distribution of micro-dimples will be changed accordingly. With the increase of the nose radius and feed rate, the dimple width and distance between adjacent dimples along feed direction can both increase accordingly. The simulation results not only confirm the feasibility of the proposed theoretical model, but also show that the discrete or continuous micro-dimples, with different sizes and specific shapes, can be controllably generated on cylindrical surface by 1D UVAT under intermittent cutting conditions.