Sealing Contact Transient Thermal-Structural Coupling Analysis of the Subsea Connector

Author:

Liu Dong,Yun FeihongORCID,Wang WuchaoORCID,Jiao Kefeng,Wang Liquan,Yan Zheping,Jia Peng,Wang Xiangyu,Liu Weifeng,Sun Haiting,Xu Xiujun

Abstract

Taking the subsea collect connector as an example, the sealing characteristics of the sealing structure of the subsea connector under transient thermal–structural coupling were studied. Based on Airy’s thermal stress function, the mathematical model was established, the complex stress function was used to solve the problem, and a three-dimensional transient thermal stress model of the core sealing parts was obtained. The transient thermal–structural coupling stress model of the core seal was obtained by linear superposition principle. The transient temperature field of the subsea collet connector under different working conditions was analyzed. It was found that the larger the temperature difference between the components was, the greater the difference of expansion rate was, and the greater the impact on the sealing performance of LSG was in the process of temperature variation from transient to steady distribution. Numerical simulations of various working conditions under the transient temperature field were carried out. The results showed that sudden change of the temperature and oil–gas pressure will bring about large fluctuations of the maximum contact stress and equivalent stress of the seal, which was easy to fatigue wear, and thus affect the reliability of the sealing performance. Finally, the experiment proves that the sealing ring can maintain sealing performance under the conditions of temperature-cyclic loading. The coupled mathematical model proposed in this paper could be used for the transient thermal–structural coupling theoretical analysis of similar subsea equipment.

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Heilongjiang Provincial Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Optimization,Mechanical Engineering,Computer Science (miscellaneous),Control and Systems Engineering

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3