Entropy Analysis in MHD CNTS Flow Due to a Stretching Surface with Thermal Radiation and Heat Source/Sink

Author:

Sneha K. N.,Mahabaleshwar U. S.,Sharifpur MohsenORCID,Ahmadi Mohammad HosseinORCID,Al-Bahrani Mohammed

Abstract

The consequence of magnetohydrodynamics (MHD) flow on entropy generation analysis and thermal radiation for carbon nanotubes via a stretched surface through a magnetic field has been discovered. The governing partial differential equations are altered into ordinary differential equations with the aid of the similarity variable. Here, water is considered the base fluid with two types of carbon nanotubes, such as single-wall carbon nanotubes (SWCNTs) and multi-wall carbon nanotubes (MWCNTs). This domain is used in the energy equation, and then it is solved analytically and transferred in terms of hypergeometric function. The existence and nonexistence of solutions for stretching are investigated. Some of the primary findings discussed in this article show that the presence of carbon nanotubes, magnetic field, and Eckert number develop heat transfer in nanofluids and heat sources and that Eckert number reduces entropy formation. Different regulating parameters, such as Casson fluid, mass transpiration, thermal radiation, solid volume fractions, magnetic constraint, and heat source/sink constraint, can be used to analyze the results of velocity and temperature profiles. The novelty of the current study on the influence of magnetic field entropy analysis on CNTs flow with radiation, is that elastic deformation is the subject of this research, and this has not previously been examined. Higher values of heat sources and thermal radiation enhance the heat transfer rate. The study reveals that thermal radiation, Casson fluid; mass transpiration, Darcy number, and Prandtl number increase, and that decrease in the buoyancy ratio, magnetic parameter, and volume fraction decrease the values of the buoyancy ratio, and also control the transfer of heat.

Publisher

MDPI AG

Subject

General Mathematics,Engineering (miscellaneous),Computer Science (miscellaneous)

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