Performance and Interfacial Microstructure of Al/Steel Joints Welded by Resistance Element Welding

Author:

Wang Nannan123,Li Jinpeng12,Wu Wenjie1,Bao Xiaohui1,Ren Kexu1,Zhao Jianghui4,Yao Huai4,Qiu Ranfeng4ORCID

Affiliation:

1. Guanghan Campus, Civil Aviation Flight University of China, Guanghan 618307, China

2. Luoyang College, Civil Aviation Flight University of China, Luoyang 471000, China

3. Key Laboratory of Flight and Operation of General Aviation Training, Luoyang 471000, China

4. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China

Abstract

In this study, an upper sheet of an A6061 aluminum alloy and a lower sheet of Q235 steel were welded by resistance element welding with a steel rivet. The temperature field during welding was calculated using ABAQUS numerical simulation software, and the interfacial microstructure was observed. A nugget was formed between the rivet shank and the lower sheet. With increases in welding current and welding time, the tensile shear load of the joint increased first and then decreased slightly. When the welding current was 14 kA and the welding time was 300 ms, the tensile shear load of the joint reached a maximum of 7.93 kN. The smaller the distance from the position to the lower sheet along the interface between the rivet shank and upper sheet, the longer the high-temperature duration and the higher the peak temperature during welding. At the junction of the rivet shank, upper sheet, and lower sheet in the joint, the high-temperature duration was the longest, at about 392 ms, and the peak temperature was the highest, at about 1237 °C. The results show that the smaller the distance from the position to the lower sheet along the interface between the rivet shank and the upper sheet in the joint, the thicker the reaction layer generated there, and that the thickness of the reaction layer was about 2.0 μm at the junction of the rivet shank, upper sheet, and lower sheet in the joint.

Funder

Fundamental Research Funds for the Central Universities

Publisher

MDPI AG

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