Analysis of Microchannel Heat Sink of Silicon Material with Right Triangular Groove on Sidewall of Passage

Abstract

Microchannel heat sink (MCHS) is a promising solution for removing the excess heat from an electronic component such as a microprocessor, electronic chip, etc. In order to increase the heat removal rate, the design of MCHS plays a vital role, and can avoid damaging heat-sensitive components. Therefore, the passage of the MCHS has been designed with a periodic right triangular groove in the flow passage. The motivation for this form of groove shape is taken from heat transfer enhancement techniques used in solar air heaters. In this paper, a numerical study of this new design of microchannel passage is presented. The microchannel design has five variable groove angles, ranging from 15° to 75°. Computational fluid dynamics (CFD) is used to simulate this unique microchannel. Based on the Navier–Stokes and energy equations, a 3D model of the microchannel heat sink was built, discretized, and laminar numerical solutions for heat transfer, pressure drop, and thermohydraulic performance were derived. It was found that Nusselt number and thermo-hydraulic performance are superior in the microchannel with a 15° groove angle. In addition, thermohydraulic performance parameters (THPP) were evaluated and discussed. THPP values were found to be more than unity for a designed microchannel that had all angles except 75°, which confirm that the proposed design of the microchannel is a viable solution for thermal management.