Influence of the Wire Spatial Structure on the Distribution of Product and the Peak Overpressure of Shockwave Generated by the Electric Explosion

Author:

Han Zhongxing1,Guo Yanbao1,Liu Ben2,Zhang Zheng1,Lin Tao1,Wang Deguo1

Affiliation:

1. College of Mechanical and Transportation Engineering, China University of Petroleum, Beijing 102249, China

2. Sinopec Research Institute of Petroleum Engineering, Beijing 102206, China

Abstract

The deposition energy and the peak overpressure of shockwaves are the leading engineering parameters of wire electric explosion technology applied to enhance oil recovery. The thicker Cu wire deposits more energy, which transforms into the shockwave efficiently. Therefore, the effects of three diameters (0.3, 0.4, and 0.5 mm) and hollow ratios (0, 0.5, and 0.7) on the electric explosion efficiency were studied by collecting pulse current, explosion products, and shockwaves during the test. All spatial structure designs of the wire depend on the skin effect parameters of the pulse discharge current. The results found that the peak overpressure of the shockwave soars with the increase of the hollow ratios when the diameter is constant. The range of the peak overpressure is 25.2~47.7 MPa. However, the correlation between shockwave and wire diameter changes from negative to positive with the increase of the hollow ratio from 0 to 0.7. The phase distribution deduced by the particle morphology and quantity distribution indicates that it is going to be uniform gradually with the hollow ratio rising from 0 to 0.7. When the extreme simplification is carried out without considering the magnetic diffusion process, it is indicated that the distribution of temperature and phase states along the wire radial is a Bessel function depending on the skin effect of the current density when three times the theoretical enthalpy drives the Cu wire. It means that the desired shockwave could be obtained efficiently by increasing the diameter and the hollow ratio of wire during a wire electric explosion.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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