Research on an Intelligent Test Method for Interconnect Resources in an FPGA-Reference-Cited by-同舟云学术

Research on an Intelligent Test Method for Interconnect Resources in an FPGA

Published:2023-07-07 Issue:13 Volume:13 Page:7951
ISSN:2076-3417
Container-title:Applied Sciences
language:en
Short-container-title:Applied Sciences

Author:

Xie Weikun¹,Qi Wenjing²,Lin Xiaohui³,Wang Houjun¹

Affiliation:

1. School of Automation Engineer, University of Electronic and Technology of China, Chengdu 611731, China

2. Shenzhen Institute for Advanced Study, University of Electronic and Technology of China, Shenzhen 518110, China

3. The 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214072, China

Abstract

With the rapid development of integrated circuit production technology, the scale of FPGA circuits has expanded to billions of gates. The complexity of the internal resource structures in the FPGAs (field programmable gate arrays) is continually increasing, and there is an increasing possibility of various faults in these circuits, especially in interconnect resources. These occupy more than 80% of a chip’s area and have the highest fault rate. To ensure the reliability of the FPGAs, it is very important to perform high-coverage testing on the interconnect resources within them. This article uses AMD Xilinx’s Kintex-7 series FPGA as the research object and proposes a deep-priority algorithm based on graph-based models and improved priority algorithms to intelligently wire the FPGA interconnected resources. The routing results were produced using a configuration script written in the XDL language, and the FPGA configuration and testing were conducted accordingly. This approach achieved a high coverage and intelligent testing for the interconnect resources in the FPGAs.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

Link

https://www.mdpi.com/2076-3417/13/13/7951/pdf

Reference18 articles.

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