Effect of Pulse Current-Assisted Rolling on the Interface Bonding Strength and Microstructure of Cu/Al Laminated Composite

Abstract

In this paper, Cu/Al laminated composite was prepared by adopting the pulse current-assisted rolling method, and the microstructure and mechanical properties of the material were investigated. The results showed that the Cu/Al laminated composite with pulsed current was significantly strengthened. The composite interface of Cu/Al laminated composite with pulse current-assisted rolling was found without intermetallic phase, and its bonding mode was mainly mechanical combined. The number of reticulated ridges increased at the shear interface. The small cracks on the copper surface were firmly embedded in the aluminum metal. There were obvious folds on the copper surface without aluminum embedding. The structural change of the bonding interface increases the contact area between copper sheet and aluminum sheet, thereby enhancing the bonding strength of the Cu/Al laminated composite.