Thermal Deformation Behavior and Interface Microstructure Analysis of 2205/Q345 Hot Compression Composite

Author:

Wang Xiaoyang,Liu Pengtao,Zhao Guanghui,Li JuanORCID,Zhi Chenchen

Abstract

The high-temperature thermal deformation behavior of a 2205/Q345 specimen at 850–1100 °C and strain rate of 0.01–10 s−1 was systematically studied by the Gleeble-3800 thermal simulator, which provided a theoretical basis for the optimization of a 2205 duplex stainless steel composite plate. It is found that the deformation resistance of 2205 steel was different from that of Q345 steel. Therefore, the Q345 steel deformed first, the degree of deformation was large, the degree of recrystallization occurred, and the grain was isometric and relatively large. The 2205 steel was subsequently deformed, the degree of deformation was relatively small, and the microstructure retained the original rolled and elongated structure. In particular, 2205 and Q345 show a coordinated deformation trend as a whole at 1050 °C and 1–10 s−1. Under the action of shear stress, there are many fine grains at the composite interface.

Funder

Pengtao Liu

Publisher

MDPI AG

Subject

Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering

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