Printing Cu on a Cold-Sprayed Cu Plate via Selective Laser Melting—Hybrid Additive Manufacturing

Author:

Chai Qing1ORCID,Jiang Chaoxin1,Huang Chunjie2,Xie Yingchun3,Yan Xingchen3,Lupoi Rocco4,Zhang Chao1ORCID,Rusinov Peter5ORCID,Yin Shuo14ORCID

Affiliation:

1. College of Mechanical Engineering, Yangzhou University, Yangzhou 225127, China

2. Materials Technology, Helmut-Schmidt-University/University of the Federal Armed Forces Hamburg, 22043 Hamburg, Germany

3. The Key Lab of Guangdong for Modern Surface Engineering Technology, National Engineering Laboratory for Modern Materials Surface Engineering Technology, Institute of New Materials, Guangdong Academy of Sciences, Guangzhou 510651, China

4. Department of Mechanical, Manufacturing and Biomedical Engineering, Trinity College Dublin, The University of Dublin, Parsons Building, D02 PN40 Dublin, Ireland

5. Department of “Engineering of Control Systems, Materials and Technologies in Mechanical Engineering”, Kuban State Technological University, Moskovskaya Street 2, 350072 Krasnodar, Russia

Abstract

The development of the additive manufacturing (AM) technology proffers challenging requirements for forming accuracy and efficiency. In this paper, a hybrid additive manufacturing technology combining fusion-based selective laser melting (SLM) and solid-state cold spraying (CS) was proposed in order to enable the fast production of near-net-shape metal parts. The idea is to fabricate a bulk deposit with a rough contour first via the “fast” CS process and then add fine structures and complex features through “slow” SLM. The experimental results show that it is feasible to deposit an SLM part onto a CS part with good interfacial bonding. However, the CS parts must be subject to heat treatment to improve their cohesion strength before being sending for SLM processing. Otherwise, the high tensile residual stress generated during the SLM process will cause fractures and cracks in the CS part. After heat treatment, pure copper deposited by CS undergoes grain growth and recrystallization, resulting in improved cohesive strength and the release of the residual stress in the CS parts. The tensile test on the SLM/CS interfacial region indicates that the bonding strength increased by 38% from 45 ± 7 MPa to 62 ± 1 MPa after the CS part is subject to heat treatment, and the SLM/CS interfacial bonding strength is higher than the CS parts. This study demonstrates that the proposed hybrid AM process is feasible and promising for manufacturing free-standing SLM-CS components.

Funder

Guangdong Academy of Sciences Special Fund for Comprehensive Industrial Technology Innovation Center Building

GDAS’ project of Science and Technology Development

Publisher

MDPI AG

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

Reference31 articles.

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