Insights into Temperature Simulation and Validation of Fused Deposition Modeling Processes

Author:

Santos Tiago12ORCID,Belbut Miguel1,Amaral João3ORCID,Amaral Vitor3ORCID,Ferreira Nelson124ORCID,Alves Nuno125ORCID,Pascoal-Faria Paula124ORCID

Affiliation:

1. CDRSP—Centre for Rapid and Sustainable Product Development, Polytechnic of Leiria, 2430-028 Marinha Grande, Portugal

2. ARISE—Associated Laboratory on Advanced Production and Intelligent Systems, 4050-313 Porto, Portugal

3. CICECO—Aveiro Institute of Materials, Department of Physics, University of Aveiro, 3810-193 Aveiro, Portugal

4. Mathematics Department, School of Management and Technology, Polytechnic of Leiria, 2411-901 Leiria, Portugal

5. Mechanical Engineering Department, School of Management and Technology, Polytechnic of Leiria, 2411-901 Leiria, Portugal

Abstract

In fused deposition modeling (FDM), the cooling history impacts the bonding between filaments and layers. The existence of thermal gradients can cause non-homogeneous properties and localized stress points that may affect the individual filaments, resulting in distortion and detachment. Thermal analysis can aid in understanding the manufacturing flaw, providing necessary tools for the optimization of the printing trajectory. The present work is intended to deepen understanding of the thermal phenomena occurring during the extrusion of polymeric materials, aiming at more efficient three-dimensional (3D) printing methods. A one-dimensional (1D) finite differential method was implemented using MATLAB to simulate the temperature evolution of an extruded filament, and the results were compared with two-dimensional (2D) COMSOL Multiphysics simulations, and experimentally validated using infrared thermography. Acrylonitrile–butadiene–styrene (ABS) was used as a test material. The energy dissipation includes forced convection and radiation heat losses to the surrounding medium.

Funder

Fundação para a Ciência e a Tecnologia

Associate Laboratory ARISE

FCT projects Stimuli2BioScaffold

OptiBioScaffold

CICECO-Aveiro Institute of Materials

Publisher

MDPI AG

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3