Research on a Simplified Model of an Aluminum Vapor Chamber in a Heat Dissipation System

Author:

Han Shuang,Yang LixinORCID,Tian Zihao,Yuan Xiaofei,Lu Hongyan

Abstract

With the rapid increase of power densities of electronic components, the traditional heat dissipation method of air forced convection has reached a heat transfer limit. As efficient phase change heat exchangers, vapor chambers have become an important guarantee for the development of high-power electronic components. Aluminum vapor chambers have become the future development trend because they are more lightweight and less expensive. In order to study the suitable simplified model of the aluminum vapor chamber in the radiating system, the testing system is established to test the thermal characteristics of the vapor chamber. First, six simplified models of the vapor chamber are proposed. Then, the thermal characteristics of the simplified models are simulated by STAR CCM+ software. Next, the error of the thermal resistance of the simplified model and the real vapor chamber is analyzed. Finally, a most suitable simplified model is obtained in the cooling system.

Publisher

MDPI AG

Subject

General Physics and Astronomy

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A novel 3-D pulsating heat pipe module for high heat-flux applications;Applied Thermal Engineering;2023-06

2. Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview;Renewable and Sustainable Energy Reviews;2022-12

3. Deployment of vapour chambers for electronic heat dissipation: state-of-the-art;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2022-05-19

4. Studies on heat transfer characteristics of vapor chamber under periodic-pulsed heat source;Advances in Mechanical Engineering;2022-04

5. Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink;Energies;2022-02-04

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