Tool Wear Monitoring in Micro-Milling Based on Digital Twin Technology with an Extended Kalman Filter

Author:

Christiand Christiand1ORCID,Kiswanto Gandjar1ORCID,Baskoro Ario Sunar1ORCID,Hasymi Zulhendri1ORCID,Ko Tae Jo2ORCID

Affiliation:

1. Mechanical Engineering Department, Universitas Indonesia, Depok 16424, Jawa Barat, Indonesia

2. School of Mechanical Engineering, Yeungnam University, Gyeongsan 38541, Gyeongbuk, Republic of Korea

Abstract

In order to avoid catastrophic events that degrade the quality of machined products, such as tool breakage, it is vital to have a prognostic system for monitoring tool wear during the micro-milling process. Despite the long history of the tool wear monitoring field, creating such a system to track, monitor, and foresee the rapid progression of tool wear still needs to be improved in the application of micro-milling. On the other hand, digital twin technology has recently become widely recognized as significant in manufacturing and, notably, within the Industry 4.0 ecosystem. Digital twin technology is considered a potential breakthrough in developing a prognostic tool wear monitoring system, as it enables the tracking, monitoring, and prediction of the dynamics of a twinned object, e.g., a CNC machine tool. However, few works have explored the digital twin technology for tool wear monitoring, particularly in the micro-milling field. This paper presents a novel tool wear monitoring system for micro-milling machining based on digital twin technology and an extended Kalman filter framework. The proposed system provides wear progression notifications to assist the user in making decisions related to the machining process. In an evaluation using four machining datasets of slot micro-milling, the proposed system achieved a maximum error mean of 0.038 mm from the actual wear value. The proposed system brings a promising opportunity to widen the utilization of digital twin technology with the extended Kalman filter framework for seamless data integration for wear monitoring service.

Funder

Universitas Indonesia

Beasiswa Pendidikan Indonesia (BPI) from the Indonesia Endowment Fund for Education

Publisher

MDPI AG

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