A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/9/10/860/pdf
Reference27 articles.
1. Solder joint fatigue models: review and applicability to chip scale packages
2. Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact
3. On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes
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