Wireless, Material-Integrated Sensors for Strain and Temperature Measurement in Glass Fibre Reinforced Composites
Author:
Bertram Lukas1, Brink Michael2, Lang Walter1
Affiliation:
1. Institute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany 2. BIBA—Bremer Institut für Produktion und Logistik GmbH, 28359 Bremen, Germany
Abstract
Fiber reinforced plastics (FRP) offer huge potentials for energy efficient applications. Special care must be taken during both FRP fabrication and usage to ensure intended material properties and behavior. This paper presents a novel approach for the monitoring of the strain and temperature of glass fibre reinforced polymer (GFRP) materials in the context of both production process monitoring and structural health monitoring (SHM) applications. The sensor is designed to be integrated into GFRPs during the production process, and the sensor concept includes possibilities of automated placement during textile layup. To minimize sensor impact on GFRP integrity and to simplify vacuum setup and part handling, the sensor operates without the need for either wires or a battery. In the first sections of this work, sensor concept, design and prototype fabrication are presented. Subsequently, it is shown how the sensors can be used for flow front monitoring and cure estimation during GFRP production by measuring local resin temperature. The resulting specimens are then characterized regarding strain measurement capabilities, mechanical influence on the host component and overall system limitations. Average strain sensor accuracy is found to be ≤0.06 mm/m, while a maximum operation temperature of 126.9 °C and a maximum reading distance of 38 mm are measured. Based on a limited number of bending tests, no negative influence of sensor presence on breaking strength could be found. Possible applications include structural components, e.g., wind turbine blades or boat hulls.
Funder
the German Federal Ministry for Economic Affairs and Climate Action
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
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