Integrated Platform for Determining Solderability Parameters: Module for Measuring the Surface Tension of Liquid Solders

Abstract

This article describes a module and method for measuring the surface tension of liquid solders implemented on a measuring device as part of an integrated platform for automatic measurement of brazebility parameters at high temperatures. A concept for constructing a test stand is presented, with a description of the individual functional blocks. The developed stand allows for testing of the solder’s surface tension. The surface tension is one of the parameters that describe the thermodynamics of interfacial reactions and the structure of newly created joints. Determining the physicochemical interactions between liquid and solid substances is crucial for various industrial processes in fields such as metallurgy, electronics, and aviation, mainly where soldering and brazing technologies are employed. A series of bubble experiments in solder for a ceramic capillary is carried out to verify the proposed method using the developed system. One of these experiments is described in this article.