Cutting Mechanical Properties of Pumpkin Grafted Seedling Investigated by Finite Element Simulation and Experiment

Author:

Lu Daipeng,Wang Wei,Bao Encai,Wang Shilin,Wu Xue,Bai Zongchun,Tang Yuxin

Abstract

The cutting device in the seedling grafting process was studied, which provided a reference for optimizing the structural parameters and working parameters of important shearing components in the seedling grafting line, thereby improving the performance of the cutting device. The dynamic cutting process of the cutting device was numerically simulated. The effects of four factors, the average cutting speed (X1), the sliding angle (X2), the cutting edge angle (X3), and the cutter clearance (X4) on the cutting force, were studied. The optimal combination of structural parameters and working parameters of the cutting device was determined. The simulation results showed that the sliding angle (X2) and the cutting edge angle (X3) affect the ultimate cutting stress. The average cutting speed (X1) and the cutter clearance (X4) affect the ultimate cutting force. When X1, X2, X3, and X4 are 579 mm/s, 39°, 25°, and 1.4 mm, respectively, it is the better combination parameter, and the ultimate cutting equivalent stress of the cutting device is 0.32 Mpa. A high-speed cutting device for grafted seedlings was built, and the cutting experiment was carried out. The experiment results showed that the simulated values fit well with the experimental data. Under the optimal combination of cutting parameters, the cutting stress of the cutting device was smaller. The finite element simulation of the seedling grafting cutting device reduces the experiment cost and provides a reference for developing the seedling grafting line.

Funder

Agricultural Science and Technology Innovation Fund

Jiangsu Agricultural Science and Technology Innovation Fund

Publisher

MDPI AG

Subject

Plant Science,Agronomy and Crop Science,Food Science

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