Passive Films Formed on Fe- and Ni-Based Alloys in an Alkaline Medium: An Insight into Complementarities between Electrochemical Techniques and Near-Field Microscopies (AFM/SKPFM)

Author:

Benaioun N. E.12ORCID,Moulayat N.2ORCID,Hakiki N. E.2,Ramdane H.2,Denys E.1,Florentin A.1,Khodja K. D.3,Heireche M. M.4,Bubendorff J. L.1

Affiliation:

1. Université de Strasbourg(UdS)-Université de Haute Alsace (UHA), Institut de Science des Matériaux de Mulhouse (IS2M), UMR 7361 du CNRS, 3b rue Alfred Werner, 68093 Mulhouse, France

2. Laboratoire de Physique des Couches Minces et Matériaux pour l’Electronique (LPC2ME), Université d’Oran I Ahmed Benbella, BP 1524, El M’Naouer, Oran 31000, Algeria

3. Laboratoire de Théorie et de Simulation des Matériaux, Université d’Oran I Ahmed Benbella, BP 1524, El M’Naouer, Oran 31000, Algeria

4. Ecole National Supérieure d’Oran, BP 1063 SAIM MOHAMED, Oran 31003, Algeria

Abstract

This study investigates the natural passivation process of two types of stainless steels (AISI 316 and AISI 304) and a nickel-based alloy (Inconel 600) as a function of immersion time in an alkaline medium. As shown by Atomic Force Microscopy (AFM), the oxide film growth on each substrate is only influenced by trenches formed during the polishing step and does not depend on the chemical composition. The evolution of EIS measurements is explained by this growth mode. After 3 days of immersion, the formed film constitutes a protective barrier against alloy dissolution, as shown by Scanning Kelvin Probe Microscopy (SKPFM).

Funder

French–Algerian exchange and research program Tassili

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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