Fabrication of Multifunctional Silylated GO/FeSiAl Epoxy Composites: A Heat Conducting Microwave Absorber for 5G Base Station Packaging-Reference-Cited by-同舟云学术

Fabrication of Multifunctional Silylated GO/FeSiAl Epoxy Composites: A Heat Conducting Microwave Absorber for 5G Base Station Packaging

Published:2023-12-05 Issue:24 Volume:16 Page:7511
ISSN:1996-1944
Container-title:Materials
language:en
Short-container-title:Materials

Author:

Xie Zhuyun¹^ORCID,Xiao Dehai¹,Yu Qin¹^ORCID,Wang Yuefeng¹,Liao Hanyi¹,Zhang Tianzhan²,Liu Peijiang³^ORCID,Xu Liguo⁴^ORCID

Affiliation:

1. Centre of Chip Chemistry, Huangpu Institution of Materials, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Guangzhou 510663, China

2. College of Material Science and Engineering, Jilin Jianzhu University, Changchun 130119, China

3. Reliability Physics and Application Technology of Electronic Component Key Laboratory, The Fifth Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, China

4. College of Light Chemical Industry and Materials Engineering, Shunde Polytechnic, Foshan 528333, China

Abstract

A multifunctional microwave absorber with high thermal conductivity for 5G base station packaging comprising silylated GO/FeSiAl epoxy composites were fabricated by a simple solvent-handling method, and its microwave absorption properties and thermal conductivity were presented. It could act as an applicable microwave absorber for highly integrated 5G base station packaging with 5G antennas within a range of operating frequency of 2.575–2.645 GHz at a small thickness (2 mm), as evident from reflection loss with a maximum of −48.28 dB and an effective range of 3.6 GHz. Such a prominent microwave absorbing performance results from interfacial polarization resonance attributed to a nicely formed GO/FeSiAl interface through silylation. It also exhibits a significant enhanced thermal conductivity of 1.6 W/(mK) by constructing successive thermal channels.

Publisher

MDPI AG

Subject

General Materials Science

Link

https://www.mdpi.com/1996-1944/16/24/7511/pdf

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