Laser Direct Writing of Thick Hybrid Polymers for Microfluidic Chips-Reference-Cited by-同舟云学术

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Laser Direct Writing of Thick Hybrid Polymers for Microfluidic Chips

Published:2014-07-22 Issue:3 Volume:5 Page:472-485
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Singh Akanksha,Scotti Gianmario,Sikanen Tiina,Jokinen Ville,Franssila Sami

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

http://www.mdpi.com/2072-666X/5/3/472/pdf

Reference16 articles.

1. Frabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist;Lorenz;Microsyst. Technol.,1997

2. A comparative study of different thick photoresists for MEMS applications;Koukharenko;J. Mater. Sci. Mater. Electron.,2005

3. MEMS Lithography;Franssila,2010

4. Free-standing SU-8 microfluidic chips by adhesive bonding and release etching

5. Fabrication and multifunction integration of microfluidic chips by femtosecond laser direct writing

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1. Organs on chips: fundamentals, bioengineering and applications;Journal of Artificial Organs;2024-08-12

2. Fabrication of pyrolytic carbon interdigitated microelectrodes by maskless UV photolithography with epoxy-based photoresists SU-8 and mr-DWL;Micro and Nano Engineering;2024-06

3. Fabrication of microfluidic chips using laser click deposition;Sensors & Diagnostics;2022

4. Assessing the Viscoelasticity of Photopolymer Nanowires Using a Three-Parameter Solid Model for Bending Recovery Motion;Nanomaterials;2021-11-04

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