Measurements of True Leak Rates of MEMS Packages-Reference-Cited by-同舟云学术

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Measurements of True Leak Rates of MEMS Packages

Published:2012-03-06 Issue:3 Volume:12 Page:3082-3104
ISSN:1424-8220
Container-title:Sensors
language:en
Short-container-title:Sensors

Author:

Han Bongtae

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

http://www.mdpi.com/1424-8220/12/3/3082/pdf

Reference29 articles.

1. Low temperature bonding of epitaxial lift off devices with AuSn;Dohle;IEEE Trans. Compon. Packag. Manuf. Technol. Part B,1996

2. Adhesive wafer bonding;Niklaus;J. Appl. Phys,2006

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