Aluminium Wires Have the Free Air Balls (FABs): Electronic Flame-Off, Fracture Strength, Electrical Properties, and Bonding Characteristics of Nano Zn Film Al–Si Bonding Wires
Author:
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
http://www.mdpi.com/2075-4701/7/5/152/pdf
Reference22 articles.
1. Microstructural evolution of ultrasonic-bonded aluminum wires
2. Erratum: “Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates”
3. Rapid fabrication and packaging of AlGaN/GaN high-temperature ultraviolet photodetectors using direct wire bonding
4. Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate
5. Table of Electrical Resistivity and Conductivityhttp://chemistry.about.com/od/moleculescompounds/a/Table-Of-Electrical-Resistivity-And-Conductivity.htm
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3. Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium;Materials;2022-03-22
4. Effects of electrolyte towards copper wire metallurgical interconnection in semiconductor;Journal of Physics: Conference Series;2022-01-01
5. Wedge bonding technologies: microstructure, mechanical properties and electrical properties of fine Al–Zn–Si alloy wire;Journal of Materials Science: Materials in Electronics;2020-05-04
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