Deformation Monitoring of Earth Fissure Hazards Using Terrestrial Laser Scanning

Author:

Ge YunfengORCID,Tang Huiming,Gong Xulong,Zhao Binbin,Lu Yi,Chen Yong,Lin Zishan,Chen Hongzhi,Qiu Yashi

Abstract

Deformation monitoring is a powerful tool to understand the formation mechanism of earth fissure hazards, enabling the engineering and planning efforts to be more effective. To assess the evolution characteristics of the Yangshuli earth fissure hazard more completely, terrestrial laser scanning (TLS), a remote sensing technique which is regarded as one of the most promising surveying technologies in geohazard monitoring, was employed to detect the changes to ground surfaces and buildings in small- and large-scales, respectively. Time-series of high-density point clouds were collected through 5 sequential scans from 2014 to 2017 and then pre-processing was performed to filter the noise data of point clouds. A tiny deformation was observed on both the scarp and the walls, based on the local displacement analysis. The relative height differences between the two sides of the scarp increase slowly from 0.169 m to 0.178 m, while no obvious inclining (the maximum tilt reaches just to 0.0023) happens on the two walls, based on tilt measurement. Meanwhile, global displacement analysis indicates that the overall settlement slowly increases for the ground surface, but the regions in the left side of scarp are characterized by a relatively larger vertical displacement than the right. Furthermore, the comparisons of monitoring results on the same measuring line are discussed in this study and TLS monitoring results have an acceptable consistency with the global positioning system (GPS) measurements. The case study shows that the TLS technique can provide an adequate solution in deformation monitoring of earth fissure hazards, with high effectiveness and applicability.

Funder

the Open Project of Key Laboratory of Earth Fissures Geological Disaster, Ministry of Land and Resources

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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