Structure and Properties of Cast Ti-Al-Si Alloys

Author:

Knaislová AnnaORCID,Novák PavelORCID,Linhart Jiří,Szurman Ivo,Skotnicová KateřinaORCID,Juřica Jan,Čegan Tomáš

Abstract

Intermetallic compounds based on Ti-Al- (Si) are attractive materials with good thermal stability and low density. However, the production of these materials is quite complicated. Partially modified conventional methods of melting metallurgy are most often used due to availability, possible high productivity, and relatively low production costs. Therefore, some technologies for the production of intermetallics based on Ti-Al are currently available, but with certain disadvantages, which are caused by poor casting properties or extreme reactivity of the melt with crucibles. Some shortcomings can be eliminated by modifying the melting technology, which contributes to increasing the cost of the process. The work deals with the preparation of Ti-Al-Si intermetallic compounds with different contents of aluminum and silicon, which were produced by centrifugal casting in an induction vacuum furnace Linn Supercast-Titan. This process could contribute to the commercial use of these alloys in the future. For this research, the TiAl15Si15(in wt.%) alloy was selected, which represents a balanced ratio of aluminides and silicides in its structure, and the TiAl35Si5 alloy, which due to the lower silicon content allows better melting conditions, especially with regard to the melting temperature. This alloy was also investigated after HIP (“Hot Isostatic Pressing”) treatment.

Funder

Ministerstvo Školství, Mládeže a Tělovýchovy

Publisher

MDPI AG

Subject

General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3