Bending Strength of Wood Treated with Propolis Extract and Silicon Compounds

Author:

Woźniak MagdalenaORCID,Mania PrzemysławORCID,Roszyk EdwardORCID,Ratajczak Izabela

Abstract

The modification of wood and its treatment with various preservatives may affect its mechanical properties, hence the knowledge of the character changes in wood caused by impregnation is of great importance. Therefore, the aim of the research was to determine the effect of impregnation, with the propolis-silane preparation (EEP-MPTMOS/TEOS) consisting of the propolis extract (EEP) and silicon compounds: 3-(trimethoxysilyl)propyl methacrylate (MPTMOS) and tetraethoxysilane (TEOS), on the bending strength of treated wood. Moreover, in the study wood treated with components of the propolis-silane formulation was used, namely 70% ethanol, the propolis extract, and silanes (MPTMOS/TEOS). In order to determine whether the impregnation of wood affects its long-term bending, creep tests were performed depending on the humidity. The impregnation of wood with the propolis extract and the propolis-silane preparation (EEP-MPTMOS/TEOS) contributed to the increase in modulus of rapture and work to maximum load values compared to the untreated wood. In dry wood condition, the wood treated with EEP and EEP-MPTMOS/TEOS was characterized by lower modulus of elasticity values than the control samples. In turn, in wet wood condition, wood treated with the propolis-silane preparation showed an increase in the MOE value. Moreover, the impregnation of wood had an influence on the wood creep process under bending loads. The treated wood was characterized by higher relative creep compliance than the untreated wood. The exception was the wood impregnated with EEP-MPTMOS/TEOS, which showed comparable relative creep compliance to the control samples. The presented results indicate that wood treated with a bio-friendly preparation based on propolis and silicon compounds can be used in various application and also in variable humidity conditions.

Funder

Ministerstwo Nauki i Szkolnictwa Wyższego

Publisher

MDPI AG

Subject

General Materials Science

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