Study on Adhesion Force of Graphene under Cylinder–Plane Contact

Author:

Shi Kai1,Hu Manfeng2,Huang Ping1ORCID

Affiliation:

1. School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China

2. School of Electrical Engineering, Guangzhou Railway Polytechnic, Guangzhou 510430, China

Abstract

There are many cylinder–plane contacts in microaccelerators, microgyroscopes, and RF switches. Adhesion is one of the main factors affecting the manufacture and use of these micro–nano devices, but its research is insufficient. Graphene is expected to be used in these fields due to its excellent electrical and mechanical properties. Therefore, it is significant to research the adhesion force of graphene under cylinder–plane. Firstly, the meniscus formation process was introduced using the variable-water-contact-angle method. Secondly, the adhesion force of the graphene surface was measured with a cylindrical atomic-force-microscope probe. Finally, the contact area was considered as a number of nanoscale cylinders in contact with the plane, and the adhesion force of the cylinder–plane model was obtained. The results showed that there was a maximum adhesion force at a relative humidity of 65%. The adhesion force was evidently not time-dependent when the relative humidity was below 45%, because the meniscus cannot be formed on the graphene surface at low relative humidity. While the graphene contact surface formed a meniscus for higher relative humidity, and the adhesion force-versus-time curves first increased and then decreased to stability. Moreover, the relationship between adhesion force and substrate contact angle, roughness, relative humidity, and dwell time was established, and the number of cylinders was determined. The error between the modified theoretical model and the experimental values was only 6%.

Funder

National Natural Science Foundation of China

Basic and Applied Basic Research Foundation of Guangdong Provinc

Publisher

MDPI AG

Subject

Surfaces, Coatings and Films,Mechanical Engineering

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