Study on the Nano-Friction Behavior of Nickel-Based Ag Film Composites Based on Molecular Dynamics

Author:

Chen Wenbang1,Chen Weihua1,Zhu Zongxiao1ORCID,Zheng Min1,Wei Xingchun1,Shi Tianzuo1,Qu Dingfeng1ORCID

Affiliation:

1. School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou 730050, China

Abstract

The nano-friction behavior of nickel-based Ag film composites was evaluated using molecular dynamics simulations. The mechanical properties, the surface morphology, the migration behavior of Ag atoms and the defect evolution during repeated friction were investigated. Our results show that the poor mechanical properties of the Ag film surface at the first stage of friction are related to a large amount of abrasive chip pileup. The slip channel with low shear strength formed by secondary friction significantly reduces the friction coefficient of the Ag film surface. Meanwhile, the migration of Ag atoms at the two-phase interface relies mainly on the repeated friction of the grinding ball, and the friction coefficient of the nickel surface decreases as the number of migrating atoms increases. In addition, the extension of defects inside the Ag film and atomic displacement is hindered by the two-phase interface. The defects inside the Ag film near the friction zone gradually evolve from an intrinsic stacking fault to a horizontal stacking fault as the friction proceeds. This is attributed to the horizontal layer-by-layer motion of Ag atoms, promoting the formation of horizontal stacking faults.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Surfaces, Coatings and Films,Mechanical Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3