Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene

Author:

Liu Chen1,Song Jingfu2,Zhao Gai13ORCID,Yin Yuhang1,Ding Qingjun1

Affiliation:

1. State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

2. School of Naval Architecture & Ocean Engineering, Jiangsu Maritime Institute, Nanjing 211170, China

3. State Key Laboratory of Bio-Fibers and Eco-Textiles, Qingdao University, Qingdao 266071, China

Abstract

The thermal conductivity, mechanical, and tribological properties of polyimide (PI) composites filled by copper (Cu), carbon nanotube (CNT), graphene nanosheet (GNS), or combination were investigated by molecular dynamics simulation (MD). The simulated results suggested that Cu can improve thermal stability and thermal conductivity, but it reduces mechanical properties and tribological properties. CNT and GNS significantly improved the thermal and tribological properties at low content, but they decreased the properties at high content. In this study, the modification mechanism, friction, and wear mechanism of different fillers on polyimide were revealed by observing the frictional interface evolution process from the atomic scale, extracting the atomic relative concentration, the temperature and velocity distribution at the friction interface, and other microscopic information.

Funder

NSFC

Natural Science Foundation of Jiangsu Province

State Key Laboratory of Bio-Fibers and Eco-Textiles

Fundamental Research Funds for the Central Universities

Priority Academic Program Development of Jiangsu Higher Education Institutions

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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