Effect of Heat Treatment on Ductility and Precipitation Size of Additively Manufactured AlSi10Mg

Author:

Megahed Sandra,Bühring JannikORCID,Duffe Tobias,Bach Aleksandar,Schröder Kai-Uwe,Schleifenbaum Johannes HenrichORCID

Abstract

Laser powder bed fusion (LPBF) is a promising technology to manufacture complex components. Aluminium (Al) alloys are extensively implemented in automotive and aerospace applications for their exceptional strength and stiffness to weight ratios. AlSi10Mg is a precipitation strengthened alloy. Due to the high cooling rate during the LPBF process, a fine microstructure in as-built samples is expected, increasing strength and hardness values. However, the ductility of as-built AlSi10Mg alloys is limited. Heat treatment allows control of microstructure influencing the mechanical properties and ductility. In this study, AlSi10Mg samples with a relative density >99.5% were manufactured with LPBF. Surface roughness values of 10.86 µm were achieved. Tensile and three-point bending samples were printed for analysis. Since load conditions of lattice structures in compression are much more complex compared to that of volume samples, increasing tensile ductility is not sufficient to determine the suitability of lattice structures for applications where high deformations are required. Therefore, lattice structures for compression testing were manufactured and individually heat treated to achieve a ductility of at least 20%. The precipitation size was found to increase depending on heat treatment from 0.44 µm up to 2.25 µm, giving insight on deformation behavior.

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

Reference41 articles.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3