Research on the Hot Deformation Process of A100 Steel Based on High-Temperature Rheological Behavior and Microstructure

Author:

Sun Chaoyuan12,Qin Yi1,Liu Yang2,Xiao Guiqian1,Zhang Jiansheng13ORCID,Zhou Jie13

Affiliation:

1. Chongqing Key Laboratory of Advanced Mold Intelligent Manufacturing, College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China

2. China National Erzhong Group Deyang Wanhang Die Forging Co., Ltd., Deyang 618013, China

3. Chongqing Jiepin Technology Co., Ltd., Chongqing 400000, China

Abstract

To obtain the optimal hot deformation process, the rheological and dynamic recrystallization behaviors of A100 steel were researched through isothermal compression tests. Firstly, a Hensel-Spittel constitutive model was established based on the stress–strain curves. Secondly, dynamic recrystallization percentage and grain size models were established to identify the necessary conditions for complete dynamic recrystallization. Finally, microstructural analysis was employed to validate the accuracy of the recrystallization model. The results indicate that the flow stress is highly sensitive to both the strain rate and the temperature, and the HS model demonstrates a high predictive accuracy, with a correlation coefficient of 0.9914. There exists a contradictory relationship between decreasing the average grain size and increasing the recrystallization percentage. The higher the percentage of dynamic recrystallization, the larger the average grain size tends to be. This situation should be avoided when devising the actual processing procedures. The optimal hot working processes for achieving complete dynamic recrystallization and a smaller average grain size are as follows: a strain equal to or greater than 0.6, a temperature between 1193 and 1353 K, and a strain rate between 0.1 and 1 s−1.

Funder

National Natural Science Foundation of China

Innovation Project of Taizhou S&T Support Program

Chongqing Special Project for Technological Innovation and Application Development

Publisher

MDPI AG

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