Interface Models in Coupled Thermoelasticity

Author:

Serpilli MicheleORCID,Dumont SergeORCID,Rizzoni Raffaella,Lebon FrédéricORCID

Abstract

This work proposes new interface conditions between the layers of a three-dimensional composite structure in the framework of coupled thermoelasticity. More precisely, the mechanical behavior of two linear isotropic thermoelastic solids, bonded together by a thin layer, constituted of a linear isotropic thermoelastic material, is studied by means of an asymptotic analysis. After defining a small parameter ε, which tends to zero, associated with the thickness and constitutive coefficients of the intermediate layer, two different limit models and their associated limit problems, the so-called soft and hard thermoelastic interface models, are characterized. The asymptotic expansion method is reviewed by taking into account the effect of higher-order terms and defining a generalized thermoelastic interface law which comprises the above aforementioned models, as presented previously. A numerical example is presented to show the efficiency of the proposed methodology, based on a finite element approach developed previously.

Publisher

MDPI AG

Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The homogenized dynamical model of a thermoelastic composite stitched with reinforcing filaments;Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences;2024-07-15

2. Hard interfaces with microstructure: the cases of strain gradient elasticity and micropolar elasticity;Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences;2024-07-15

3. Impedance operator of a curved thin layer in linear elasticity with voids;Mathematical Methods in the Applied Sciences;2024-04-12

4. A size-dependent imperfect interface model for adhesively bonded joints considering strain gradient elasticity;International Journal of Solids and Structures;2024-04

5. A quasi-static model of a thermoelastic body reinforced by a thin thermoelastic inclusion;Mathematics and Mechanics of Solids;2024-01-19

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3