Micro Defects on Diamond Tool Cutting Edge Affecting the Ductile-Mode Machining of KDP Crystal

Author:

Zhang Shuo,Zong Wenjun

Abstract

As a soft-brittle material, the machined surface quality of potassium dihydrogen phosphate (KDP) crystal is heavily affected by the edge quality of the diamond cutting tool. However, nanoscale micro defects inevitably occur on the freshly sharpened tool edge, and the machining mechanism for KDP crystal remains unclear. Therefore, in this work, three types of tool-edge micro defects are classified according to their cross-sections, including the blunt-edge, crescent-edge, and flat-edge micro defects. Moreover, the smoothed particle hydrodynamics (SPH) method is employed to reveal the material removal mechanism of KDP crystal with consideration of different tool-edge micro defects, and the flat-edge micro defects are subdivided into flat edge A (similar to flank wear) and flat edge B (similar to chamfered edge) on the basis of their effects in machining. The simulation results indicate that the surfaces machined by crescent edge and flat edge A are unsmooth with large-size defects due to the disappearance of hydrostatic pressure beneath the cutting edge. As for the blunt edge and flat edge B, the machined surfaces are smooth with a favorable increment of hydrostatic pressure for processing brittle materials, which indicates that a solution to eliminate the tool-edge micro defects is necessary, e.g., the passivation method. For keeping the cutting edge as sharp as possible in removing the tool-edge micro defects completely by passivation, the effect of tool shank depression angles on the geometries of the passivated cutting edge is investigated, and a high-quality cutting edge with a micro chamfered edge is obtained after passivation at a depression angle of 60° and re-sharpening of the rake face. Finally, the tool cutting performance after passivation is validated through fly-cutting experiments of KDP crystal. The chamfered edge can produce the best defect-free surface with the minimum surface roughness.

Funder

National Natural Science Foundation of China

Science Challenge Project

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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