A New Way of Toughening of Thermoset by Dual-Cured Thermoplastic/Thermosetting Blend

Author:

Khatiwada Shankar,Gohs Uwe,Lach Ralf,Heinrich Gert,Adhikari RameshwarORCID

Abstract

The work aims at establishing the optimum conditions for dual thermal and electron beam curing of thermosetting systems modified by styrene/butadiene (SB)-based triblock copolymers in order to develop transparent and toughened materials. The work also investigates the effects of curing procedures on the ultimate phase morphology and mechanical properties of these thermoset–SB copolymer blends. It was found that at least 46 mol% of the epoxidation degree of the SB copolymer was needed to enable the miscibility of the modified block copolymer into the epoxy resin. Hence, an electron beam curing dose of ~50 kGy was needed to ensure the formation of micro- and nanostructured transparent blends. The micro- and nanophase-separated thermosets obtained were analyzed by optical as well as scanning and transmission electron microscopy. The mechanical properties of the blends were enhanced as shown by their impact strengths, indentation, hardness, and fracture toughness analyses, whereby the toughness values were found to mainly depend on the dose. Thus, we have developed a new route for designing dual-cured toughened micro- and nanostructured transparent epoxy thermosets with enhanced fracture toughness.

Publisher

MDPI AG

Subject

General Materials Science

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3