Improving the Vertical Thermal Conductivity of Carbon Fiber-Reinforced Epoxy Composites by Forming Layer-by-Layer Contact of Inorganic Crystals

Author:

Lee Eunbi,Cho Chi Hyeong,Hwang Sae Hoon,Kim Min-Geun,Han Jeong Woo,Lee Hanmin,Lee Jun HyupORCID

Abstract

A carbon fiber-reinforced polymer (CFRP) is a light and rigid composite applicable in various fields, such as in aviation and automobile industry. However, due to its low thermal conductivity, it does not dissipate heat sufficiently and thus accumulates heat stress. Here, we reported a facile and effective strategy to improve the through-thickness thermal conductivity of CFRP composites by using a layer-by-layer coating of inorganic crystals. They could provide efficient heat transfer pathways through layer-by-layer contact within the resulting composite material. The high thermally conductive CFRP composites were prepared by employing three types of inorganic crystal fillers composed of aluminum, magnesium, and copper on prepreg through the layer-by-layer coating process. The vertical thermal conductivity of pure CFRP was increased by up to 87% on using magnesium filler at a very low content of 0.01 wt %. It was also confirmed that the higher the thermal conductivity enhancement was, the better were the mechanical properties. Thus, we could demonstrate that the layer-by-layer inclusion of inorganic crystals can lead to improved through-thickness thermal conductivity and mechanical properties of composites, which might find applications in varied industrial fields.

Funder

Ministry of Trade, Industry and Energy

National Research Foundation of Korea

Publisher

MDPI AG

Subject

General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3