Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

Author:

Morris Christopher J.,Isaacson Brian,Grapes Michael D.,Dubey Madan

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference42 articles.

1. Self-assembly from milli- to nanoscales: methods and applications;Mastrangeli;J. Micromech. Microeng.,2009

2. Self-assembly for micro and nano scale packaging: Steps toward self-packaging;Morris;IEEE Trans. Adv. Packag.,2005

3. Fluidic self-assembly of micromirrors onto microactuators using capillary forces;Srinivasan;IEEE J. Sel. Topics Quantum Electr.,2002

4. Microstructure to substrate self-assembly using capillary forces;Srinivasan;J. Microelectromechan. Syst.,2001

5. Controlled multibatch self-assembly of microdevices;Xiong;J. Microelectromechanical Syst.,2003

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1. Self-assembly of microsystem components with micrometer gluing pads through capillary forces;Journal of Manufacturing Processes;2020-05

2. A review of micro-devices assembly techniques and technology;The International Journal of Advanced Manufacturing Technology;2015-08-18

3. The Fluid Joint: The Soft Spot of Micro- and Nanosystems;Advanced Materials;2015-06-30

4. Self‐assembly: a review of scope and applications;IET Nanobiotechnology;2015-06

5. Magnetic self-assembly with unique rotational alignment for thin chips;Microelectronic Engineering;2015-06

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