Fabrication of Wireless Micro Pressure Sensor Using the CMOS Process-Reference-Cited by-同舟云学术

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Fabrication of Wireless Micro Pressure Sensor Using the CMOS Process

Published:2009-10-30 Issue:11 Volume:9 Page:8748-8760
ISSN:1424-8220
Container-title:Sensors
language:en
Short-container-title:Sensors

Author:

Dai Ching-Liang,Lu Po-Wei,Wu Chyan-Chyi,Chang Chienliu

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

http://www.mdpi.com/1424-8220/9/11/8748/pdf

Reference13 articles.

1. Study of injection molding pressure sensor with low cost and small probe;Huang;Sens. Actuat. A,2002

2. AeroMEMS sensor array for high-solution wall press measurments;Berns;Sens. Actuat. A,2006

3. Development and characterization of a surface micromachined FET pressure sensor on a CMOS process;Hynes;Sens. Actuat. A,1999

4. Surface micromachining technology applied to the fabrication of a FET pressure sensor;Svensson;J. Micromech. Microeng.,1996

5. Semiconductor pressure sensor based on FET structure;Lysko;IEEE Trans. Instrum. Meas.,1995

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