Author:
Zhang Lu,Fang Zhenmin,Tang Yongze,Li Hongyu,Liu Qizhou
Abstract
The grouted sleeve connection is one of the most widely used connections for prefabricated buildings (PBs). Usually, its quality can have a significant impact on the safety of the whole PB, especially for the internal flaws that form during sleeve grouting. It is directly related to the mechanical performance and failure behavior of the grouted sleeve. Therefore, it is essential to understand the damage progression of the defective grouted sleeve connection. However, destructive testing is the mainstream measure to evaluate the grout sleeves, which is not applicable for in situ inspection. Therefore, this paper proposes a combined acoustic emission (AE) and ultrasonic testing (UT) method to characterize the damage progress of a grouted sleeve with different degrees of internal flaws under tensile loading. The UT was conducted before loading to evaluate the internal flaws. Additionally, the AE was used as the processing monitoring technique during the tensile testing. Two damage modes were identified: (i) brittle mode associated with the rebar pullout; (ii) ductile mode associated with the rapture of the rebar. The UT energy ratio was selected as the most sensitive feature to the internal flaws, both numerically and experimentally. The AE signatures of different damage phases and different damage modes were determined and characterized. For the brittle and ductile damage modes, two and three phases appeared in the AE activities, respectively. The proposed combined AE and UT method can provide a reliable and convenient nondestructive evaluation of grouted sleeves with internal flaws. Moreover, it can also characterize the damage progress of the grouted sleeve connections in real-time.
Funder
National Natural Science Foundation of China
Guangxi Science and Technology Base and Special Fund for Talents Program
Key Laboratory of Intelligent Perception and Advanced Control of State Ethnic Affairs Commission
Guangxi Natural Science Foundation Program
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
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