Anisotropy Corrected FMC/TFM Based Phased Array Ultrasonic Imaging in an Austenitic Buttering Layer

Author:

Ponseenivasan S.1,Kumar Anish1ORCID,Rajkumar K. V.1

Affiliation:

1. Metallurgy and Materials Group, Indira Gandhi Centre for Atomic Research, A CI of Homi Bhabha National Institute, Kalpakkam 603102, Tamil Nadu, India

Abstract

For the narrow gap dissimilar weld between a ferritic steel and a nickel base superalloy, a nickel base alloy buttering layer is deposited on the ferritic steel side as an intermediate layer. The bonding between the buttering layer and the ferritic steel is required to be inspected from the buttering layer side. The buttering layer exhibits very high elastic anisotropy due to elongated columnar grains with preferred orientations. In this paper, the effect of elastic anisotropy on the phased array ultrasonic imaging of defects in the buttering layer is demonstrated for data acquired in full matrix capture (FMC) mode and reconstructed with the total focusing method (TFM). The anisotropy in the buttering layer leads to distorted flaw images, which limits the lateral resolution and defect detection sensitivity. Angle-dependent ultrasonic velocity measured in through-transmission FMC mode has been used for processing the FMC data to obtain high-resolution TFM images with improved sensitivity. The velocity values used are in line with the grain orientations observed by electron-backscatter diffraction (EBSD) studies. Further, an alternate approach is also proposed to obtain a TFM image with improved resolution using a suitable isotropic velocity. The approach can be implemented in any commercial phased array ultrasonic system having the FMC-TFM feature.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Multi-channel ultrasonic signal processing for non-destructive inspection;2023 16th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI);2023-10-28

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