Classification of a 3D Film Pattern Image Using the Optimal Height of the Histogram for Quality Inspection

Author:

Lee Jaeeun1ORCID,Choi Hongseok1,Yum Kyeongmin2ORCID,Park Jungwon3,Kim Jongnam1

Affiliation:

1. Department of Artificial Intelligence Convergence, Pukyong National University, 45, Yongso-ro, Nam-gu, Busan 48513, Republic of Korea

2. College of Business, Seoul National University, 1, Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea

3. Electronic and Computer Engineering Technology, University of Hawaii Maui College, 310 W Kaahumanu Ave, Kahului, HI 96732, USA

Abstract

A 3D film pattern image was recently developed for marketing purposes, and an inspection method is needed to evaluate the quality of the pattern for mass production. However, due to its recent development, there are limited methods to inspect the 3D film pattern. The good pattern in the 3D film has a clear outline and high contrast, while the bad pattern has a blurry outline and low contrast. Due to these characteristics, it is challenging to examine the quality of the 3D film pattern. In this paper, we propose a simple algorithm that classifies the 3D film pattern as either good or bad by using the height of the histograms. Despite its simplicity, the proposed method can accurately and quickly inspect the 3D film pattern. In the experimental results, the proposed method achieved 99.09% classification accuracy with a computation time of 6.64 s, demonstrating better performance than existing algorithms.

Funder

National Research Foundation of Korea

Small and Medium Business Technology Innovation Development Project from TIPA

Link 3.0 of PKNU

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Vision and Pattern Recognition,Radiology, Nuclear Medicine and imaging

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