Tip Crack Imaging on Transparent Materials by Digital Holographic Microscopy

Author:

Zhou ,Li ,Shen ,He ,Zhang ,Yu ,Tornari

Abstract

With this study, we propose a method to image the tip crack on transparent materials by using digital holographic microscopy. More specifically, an optical system based on Mach–Zehnder interference along with an inverted microscopy (Olympus CKX53) was used to image the tip crack of Dammar Varnish transparent material under thermal excitation. A series of holograms were captured and reconstructed for the observation of the changes of the tip crack. The reconstructed holograms were also compared temporally to compute the temporal changes, showing the crack propagation phenomena. Results show that the Dammar Varnish is sensitive to the ambient temperature. Our research demonstrates that digital holographic microscopy is a promising technique for the detection of the fine tip crack and propagation in transparent materials.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shanghai

Major State Research Development Program of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Vision and Pattern Recognition,Radiology Nuclear Medicine and imaging

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