Simulation of a Hemispherical Chamber for Thermal Inkjet Printing

Author:

Peng XishunORCID,Lu Anjiang,Li Pangyue,Chen Zhongpeng,Yu Ziran,Lin Jianwu,Wang Yi,Zhao Yibo,Yang Jiao,Cheng Jin

Abstract

It is crucial to improve printing frequency and ink droplet quality in thermal inkjet printing. This paper proposed a hemispherical chamber, and we used the CFD (computational fluid dynamics model) to simulate the inkjet process. During the whole simulation process, we first researched the hemispherical chamber’s inkjet state equipped with straight, conical shrinkage, and conical diffusion nozzles. Based on the broken time and volume of the liquid column, the nozzle geometry of the hemispherical chamber was determined to be a conical shrinkage nozzle with a specific size of 15 µm in height and 15 µm in diameter at the top, and 20 µm in diameter at the bottom. Next, we researched the inkjet performance of the square chamber, the round chamber, and the trapezoidal chamber. The round chamber showed the best inkjet performance using 1.8 µs as the driving time and 10 MPa as the maximum bubble pressure. After that, we compared the existing thermal inkjet printing heads. The results showed that the hemispherical chamber inkjet head had the best performance, achieving 30 KHz high-frequency printing and having the most significant volume ratio of droplet to the chamber, reaching 14.9%. As opposed to the current 15 KHz printing frequency of the thermal inkjet heads, the hemispherical chamber inkjet head has higher inkjet performance, and the volume ratio between the droplet and the chamber meets the range standard of 10–15%. The hemispherical chamber structure can be applied to thermal inkjet printing, office printing, 3D printing, and bio-printing.

Funder

National Natural Science Foundation of China

Project of Outstanding Young Scientific and Technological Talents of Guizhou Province

Natural Science Foundation of Guizhou Province

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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