Dual-Use Strain Sensors for Acoustic Emission and Quasi-Static Bending Measurements
Author:
Stiefvater Jason1, Kang Yuhong2, de Clerck Albrey2, Mao Shuo1, Jones Noah2, Deem Josh2, Wicks Alfred1, Ruan Hang12ORCID, Ng Wing1
Affiliation:
1. Department of Mechanical Engineering, Virginia Tech, Blacksburg, VA 24061, USA 2. NanoSonic, Inc., 158 Wheatland Drive, Pembroke, VA 24136, USA
Abstract
In this paper, a MEMS piezoresistive ultrathin silicon membrane-based strain sensor is presented. The sensor’s ability to capture an acoustic emission signal is demonstrated using a Hsu–Nielsen source, and shows comparable frequency content to a commercial piezoceramic ultrasonic transducer. To the authors’ knowledge, this makes the developed sensor the first known piezoresistive strain sensor which is capable of recording low-energy acoustic emissions. The improvements to the nondestructive evaluation and structural health monitoring arise from the sensor’s low minimum detectable strain and wide-frequency bandwidth, which are generated from the improved fabrication process that permits crystalline semiconductor membranes and advanced polymers to be co-processed, thus enabling a dual-use application of both acoustic emission and static strain sensing. The sensor’s ability to document quasi-static bending is also demonstrated and compared with an ultrasonic transducer, which provides no significant response. This dual-use application is proposed to effectively combine the uses of both strain and ultrasonic transducer sensor types within one sensor, making it a novel and useful method for nondestructive evaluations. The potential benefits include an enhanced sensitivity, a reduced sensor size, a lower cost, and a reduced instrumentation complexity.
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