Effect of Annealing Temperature on Microstructure and Properties of Solid Solution Extruded Mg–2.0Zn–1.0Y–0.5Zr Alloys

Author:

He Junguang1,Cheng Zhenfei1,Wen Jiuba12,Tian Peiwu1,Feng Wuyun1,Zheng Xiangyang1,Gong Yuan1

Affiliation:

1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China

2. Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China

Abstract

In this investigation, the effects of different annealing temperatures (180, 200, 220, 240, 260, and 280 °C) on the microstructure evolution and properties of an extruded Mg–2.0Zn–1.0Y–0.5Zr (wt%) magnesium alloys were determined. Optical microscopy (OM), scanning electron microscopy (SEM), immersion corrosion, electrochemical corrosion experiments, and tensile testing were performed. Research has found that combining hot extrusion with subsequent low-temperature annealing significantly improves the strength, plasticity, and corrosion resistance of alloys due to grain refinement and a reduced dislocation density. The alloy was completely recrystallized at an annealing temperature of 240 °C for 4 h after solid solution extrusion, and the grains were fine and uniform, demonstrating the best comprehensive properties. Its corrosion rate, ultimate tensile strength, yield strength, and elongation were 0.454 ± 0.023 mm/y, 346.7 ± 8.9 MPa, 292.4 ± 6.9 MPa, and 19.0 ± 0.4%, respectively. The corrosion mechanism of the specimens under extruded and annealed conditions was analyzed. After annealing at 240 °C for 4 h, the dislocation and bimodal grain structure of the samples were almost eliminated, resulting in uniform and fine grains, which were conducive to the formation of a more uniform and denser oxide film, thus improving the corrosion resistance of the alloy.

Funder

Henan New Nonferrous Metal Materials University Science and Technology Innovation Team Support Program of China

Henan Provincial Natural Science Foundation

Henan Key Laboratory of Non-ferrous Materials Science and Processing Technology

Publisher

MDPI AG

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